HTC Diamond Tools with 2 diamonds segment are suitable for a wide range application, like concrete grinding, concrete floor preparation, coating removal and concrete polishing.
HTC Diamond Tools mini buttons diamonds segment are suitable for a wide range application, like concrete grinding, concrete floor preparation, coating removal and concrete polishing.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Ceramic Bond Polishing Pads with velcro backing for polishing cocnrete and smoothing scraches pattern. Ceramic bonding strength is bettween metal bonding and resin bonding. Using ceramic grinding pads in between metal and resin grinding effectively remove scratch marks and reduce polishing time.
Mosdan Hybrid Copper Bond Polishing Pads are actually bonded by resin, but diamond particles are coated with copper, so copper pads get larger in size, hence more aggressive and longer lifespan. Hybrid Polishing Pucks are very ideal for Transitional polishing after metals grinding and before fine polishing. Wet or dry use are avaiable.
Mosdan Hybrid Copper Bond Polishing Pads are actually bonded by resin, but diamond particles are coated with copper, so copper pads get larger in size, hence more aggressive and longer lifespan. Hybrid Polishing Pucks are very ideal for Transitional polishing after metals grinding and before fine polishing. Wet or dry use are avaiable.